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M27C4002
4 Mbit (256Kb x16) UV EPROM and OTP EPROM
Feature summary

5V 10% Supply voltage for Read operations Access time: 45ns Low Power consumption - Active Current 70mA at 10MHz - Standby current 100a Programming Voltage: 12.75V 0.25V Programming Time: 100s/word Electronic Signature - Manufacturer Code: 20h - Device Code: 44h ECOPACK(R) packages available
PLCC44 (C) TSOP40 (N) 10 x 20 mm
40 40
1
1

FDIP40W (F)
PDIP40 (B)
April 2006
Rev 4
1/24
www.st.com 1
Contents
M27C4002
Contents
1 2 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Two line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 PRESTO II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3 4 5 6 7
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27C4002
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Characteristics 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data . . . . . . 18 PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . . 19 PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data. . . . . . . . . . . . 20 TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data . . . . . . . . . . . 21 Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27C4002
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18 PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19 PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20 TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline . . . . . . . . . . 21
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M27C4002
Summary description
1
Summary description
The M27C4002 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organized as 262,144 words of 16 bits. The FDIP40W (window ceramic frit-seal package) has transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C4002 is offered in PDIP40, PLCC44 and TSOP40 (10 x 20 mm) packages. In order to meet environmental requirements, ST offers the M27C4002 in ECOPACK(R) packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. Logic Diagram
VCC VPP
18 A0-A17
16 Q0-Q15
E G
M27C4002
VSS
AI00727B
5/24
Summary description Table 1.
A0-A17 Q0-Q15 E G VPP VCC VSS NC
M27C4002 Signal Names
Address Inputs Data Outputs Chip Enable Output Enable Program Supply Supply Voltage Ground Not Connected Internally
Figure 2.
DIP Connections
VPP E Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 VSS Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 G 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 M27C4002 11 30 12 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21
AI00728
VCC A17 A16 A15 A14 A13 A12 A11 A10 A9 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0
6/24
M27C4002 Figure 3. LCC Connections
Q13 Q14 Q15 E VPP NC VCC A17 A16 A15 A14
Summary description
1 44 Q12 Q11 Q10 Q9 Q8 VSS NC Q7 Q6 Q5 Q4 A13 A12 A11 A10 A9 VSS NC A8 A7 A6 A5
12
M27C4002
34
23 Q3 Q2 Q1 Q0 G NC A0 A1 A2 A3 A4
AI00729
Figure 4.
TSOP Connections
A9 A10 A11 A12 A13 A14 A15 A16 A17 VCC VPP E DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 1 40 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 G DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 VSS
10 11
M27C4002 (Normal)
31 30
20
21
AI01831
7/24
Device operation
M27C4002
2
Device operation
The operating modes of the M27C4002 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature.
2.1
Read mode
The M27C4002 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV.
2.2
Standby mode
The M27C4002 has a standby mode which reduces the supply current from 50mA to 100A. The M27C4002 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input.
2.3
Two line output control
Because EPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows:

The lowest possible memory power dissipation Complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device.
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M27C4002
Device operation
2.4
System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the output capacitive and inductive loading of the device. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1F ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7F bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point.The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
2.5
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C4002 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C4002 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 16 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V 0.25V.
2.6
PRESTO II programming algorithm
PRESTO II Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 26.5 seconds. Programming with PRESTO II consists of applying a sequence of 100s program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides necessary margin to each programmed cell.
9/24
Device operation Figure 5. Programming Flowchart
VCC = 6.25V, VPP = 12.75V
M27C4002
n=0
E = 100s Pulse NO ++n = 25 YES NO VERIFY YES Last Addr NO ++ Addr
FAIL
YES CHECK ALL WORDS 1st: VCC = 6V 2nd: VCC = 4.2V
AI00726C
2.7
Program Inhibit
Programming of multiple M27C4002 devices in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C4002 may be common. A TTL low level pulse applied to a M27C4002 E input, with VPP at 12.75V, will program that M27C4002. A high level E input inhibits the other M27C4002 devices from being programmed.
2.8
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and VCC at 6.25V.
2.9
Electronic Signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25C 5C ambient temperature range that is required when programming the M27C4002. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C4002 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics
10/24
M27C4002
Device operation M27C4002, these two identifier bytes are given in Table 3: Electronic Signature and can be read-out on outputs Q7 to Q0.
2.10
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27C4002 are such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 A. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 A range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C4002 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C4002 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C4002 window to prevent unintentional erasure. The recommended erasure procedure for the M27C4002 is exposure to short wave ultraviolet light which has wavelength 2537 A. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 W/cm2 power rating. The M27C4002 should be placed within 2.5cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. Table 2. Operating modes(1)
Mode Read Output Disable Program Verify Program Inhibit Standby Electronic Signature
1. X = VIH or VIL, VID = 12V 0.5V.
E VIL VIL VIL Pulse VIH VIH VIH VIL
G VIL VIH VIH VIL VIH X VIL
A9 X X X X X X VID
VPP VCC or VSS VCC or VSS VPP VPP VPP VCC or VSS VCC
Q15-Q0 Data Out Hi-Z Data In Data Out Hi-Z Hi-Z Codes
Table 3.
Electronic Signature(1)
A0 VIL VIH Q7 0 0 Q6 0 1 Q5 1 0 Q4 0 0 Q3 0 0 Q2 0 1 Q1 0 0 Q0 0 0 Hex Data 20h 44h
Identifier Manufacturer's Code Device Code
1. Outputs Q15-Q8 are set to '0'.
11/24
Maximum rating
M27C4002
3
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4.
Symbol TA TBIAS TSTG VIO(2) VCC VA9(2) VPP Ambient Operating
Absolute Maximum Ratings
Parameter Temperature(1) Value -40 to 125 -50 to 125 -65 to 150 -2 to 7 -2 to 7 -2 to 13.5 -2 to 14 Unit C C C V V V V
Temperature Under Bias Storage Temperature Input or Output Voltage (except A9) Supply Voltage A9 Voltage Program Supply Voltage
1. Depends on range. 2. Minimum DC voltage on Input or Output is -0.5V with possible undershoot to -2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
12/24
M27C4002
DC and AC parameters
4
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC Measurement Conditions
Parameter Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages High Speed 10ns 0 to 3V 1.5V Standard 20ns 0.4V to 2.4V 0.8V and 2V
Figure 6.
AC Testing Input Output Waveform
High Speed 3V 1.5V 0V
Standard 2.4V 2.0V 0.8V
AI01822
0.4V
Figure 7.
AC Testing Load Circuit
1.3V
1N914
3.3k DEVICE UNDER TEST CL
OUT
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
AI01823B
13/24
DC and AC parameters Table 6.
Symbol CIN COUT
M27C4002 Capacitance(1)(2)
Parameter Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF
Input Capacitance Output Capacitance
1. TA = 25 C, f = 1 MHz. 2. Sampled only, not 100% tested.
Table 7.
Symbol ILI ILO
Read Mode DC Characteristics(1)(2)
Parameter Input Leakage Current Output Leakage Current Test Condition 0V VIN VCC 0V VOUT VCC E = VIL, G = VIL, IOUT = 0mA, f = 10MHz E = VIL, G = VIL, IOUT = 0mA, f = 5MHz Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL IOL = 2.1mA IOH = -400A IOH = -100A 2.4 VCC - 0.7V E = VIH E > VCC - 0.2V VPP = VCC -0.3 2 Min Max 10 10 70 50 1 100 10 0.8 VCC + 1 0.4 Unit A A mA mA mA A A V V V V V
ICC
Supply Current
ICC1 ICC2 IPP VIL VIH
(3)
VOL VOH
Output High Voltage CMOS
1. TA = 0 to 70C or -40 to 85C; VCC = 5V 5% or 5V 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Maximum DC voltage on Output is VCC +0.5V.
Table 8.
Symbol ILI ICC IPP VIL VIH VOL VOH VID
Programming Mode DC Characteristics(1)(2)
Parameter Input Leakage Current Supply Current Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL A9 Voltage IOL = 2.1mA IOH = -400A 2.4 11.5 12.5 E = VIL -0.3 2 Test Condition VIL VIN VIH Min Max 10 50 50 0.8 VCC + 0.5 0.4 Unit A mA mA V V V V V
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
14/24
M27C4002 Table 9. Read Mode AC Characteristics 1(1)(2)
DC and AC parameters
M27C4002 Symbol Alt Parameter Test Condition - 45(3) Min tAVQV tELQV tGLQV tEHQZ(4) tGHQZ(4) tAXQX tACC tCE tOE tDF tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL 0 0 0 Max 45 45 25 30 30 0 0 0 -60 (3) Min Max 60 60 30 30 30 0 0 0 Min -70 Max 70 70 35 30 30 ns ns ns ns ns ns Unit
1. TA = 0 to 70C or -40 to 85C; VCC = 5V 5% or 5V 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested.
Table 10.
Read Mode AC Characteristics 2(1)(2)
M27C4002
Symbol
Alt
Parameter
Test Condition Min
-80 Max 80 80 40 0 0 0 30 30 0 0 0 Min
-90 Max 90 90 40 30 30 0 0 0 Min
-10 Max 100 100 50 30 30
Unit
tAVQV tELQV tGLQV tEHQZ(3) tGHQZ(3) tAXQX
tACC tCE tOE tDF tDF tOH
Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition
E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL
ns ns ns ns ns ns
1. TA = 0 to 70C or -40 to 85C; VCC = 5V 5% or 5V 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested.
15/24
DC and AC parameters Table 11. Read Mode AC Characteristics 3(1)(2)
M27C4002 Symbol Alt Parameter Test Condition Min tAVQV tELQV tGLQV tEHQZ(3) tGHQZ(3) tAXQX tACC tCE tOE tDF tDF tOH Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z Address Transition to Output Transition E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL 0 0 0 -12 Max 120 120 60 40 40 0 0 0 Min -15 Max 150 150 60 50 50 0 0 0 Min -20
M27C4002
Unit Max 200 200 70 80 80 ns ns ns ns ns ns
1. TA = 0 to 70C or -40 to 85C; VCC = 5V 5% or 5V 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested.
Figure 8.
Read Mode AC Waveforms
A0-A17 VALID tAVQV E tGLQV G tELQV Q0-Q15 tGHQZ Hi-Z tEHQZ tAXQX VALID
AI00731B
16/24
M27C4002 Table 12.
Symbol tAVEL tQVEL tVPHEL tVCHEL tELEH tEHQX tQXGL tGLQV tGHQZ tGHAX
DC and AC parameters Programming Mode AC Characteristics(1)(2)(3)
Alt tAS tDS tVPS tVCS tPW tDH tOES tOE tDFP tAH Parameter Address Valid to Chip Enable Low Input Valid to Chip Enable Low VPP High to Chip Enable Low VCC High to Chip Enable Low Chip Enable Program Pulse Width Chip Enable High to Input Transition Input Transition to Output Enable Low Output Enable Low to Output Valid Output Enable High to Output Hi-Z Output Enable High to Address Transition 0 0 Test Condition Min 2 2 2 2 95 2 2 100 130 105 Max Unit s s s s s s s ns ns ns
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested.
Figure 9.
Programming and Verify Modes AC Waveforms
A0-A17 tAVEL Q0-Q15 DATA IN tQVEL VPP tVPHEL VCC tVCHEL E tELEH G tQXGL tGHAX tGLQV tGHQZ tEHQX DATA OUT VALID
PROGRAM
VERIFY
AI00730
17/24
Package mechanical data
M27C4002
5
Package mechanical data
Figure 10. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline
A2
A3 A1 B1 B D2 D S
N 1
A L eA eB C
e
E1
E
FDIPW-a
1. Drawing is not to scale.
Table 13.
Symbol
FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data
millimeters Typ Min Max 5.72 0.51 3.91 3.89 0.41 1.45 - 0.23 51.79 48.26 15.24 - - 13.06 2.54 14.99 - - 16.18 3.18 1.52 7.62 - 4 40 2.49 - 11 0.300 1.40 4.57 4.50 0.56 - 0.30 52.60 - - 13.36 - - 18.03 0.100 0.590 1.900 0.600 0.057 0.020 0.154 0.153 0.016 - 0.009 2.039 - - 0.514 - - 0.637 0.125 0.060 - 4 40 0.098 - 11 Typ inches Min Max 0.225 0.055 0.180 0.177 0.022 - 0.012 2.071 - - 0.526 - - 0.710
A A1 A2 A3 B B1 C D D2 E E1 e eA eB L S N
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M27C4002
Package mechanical data
Figure 11. PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline
A2 A1 B1 B D2 D S
N
A L eA eB C
e1
E1
1
E
PDIP
1. Drawing is not to scale.
Table 14.
Symbol
PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data
millimeters Typ Min - 0.38 3.56 0.38 1.14 0.20 51.78 48.26 - 14.80 13.46 2.54 15.24 - - 15.24 3.05 1.52 0 40 Max - - 3.91 0.53 1.78 0.31 52.58 - 16.26 13.99 - - 17.78 3.81 2.29 15 0.100 0.600 1.900 Typ 0. 175 0.025 inches Min - 0.015 0.140 0.015 0.045 0.008 2.039 - 0.583 0.530 - - 0.600 0.120 0.060 0 40 0.700 0.150 0.090 15 Max - - 0.154 0.021 0.070 0.012 2.070 - 0.640 0.551 -
A A1 A2 B B1 C D D2 E E1 e1 eA eB L S N
4.45 0.64
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Package mechanical data Figure 12. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline
D D1
1N
M27C4002
A1 c
B1
E3
E1 E
E2 B
e
D3
A2 A CP
PLCC-B
D2
1. Drawing is not to scale.
Table 15.
PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data
millimeters inches Max 4.570 3.040 3.700 0.533 0.812 0.101 0.510 17.400 16.510 14.990 12.700 - 17.400 16.510 14.990 12.700 1.270 44 - - 17.650 16.662 16.000 - 17.650 16.660 16.000 - - 0.5000 0.0500 44 0.5000 0.0201 0.6850 0.6500 0.5902 - 0.6850 0.6500 0.5902 - - 0.6949 0.6560 0.6299 - 0.6949 0.6559 0.6299 - - Typ Min 0.1654 0.0902 0.1437 0.0130 0.0260 Max 0.1799 0.1197 0.1457 0.0210 0.0320 0.0040
Symbol Typ A A1 A2 B B1 CP c D D1 D2 D3 E E1 E2 E3 e N Min 4.200 2.290 3.650 0.331 0.661
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M27C4002
Package mechanical data
Figure 13. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline
A2
1 N
e E B
N/2
D1 D
A CP
DIE
C
TSOP-a
A1
L
1. Drawing is not to scale.
Table 16.
TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data
millimeters inches Max 1.200 0.050 0.950 0.170 0.100 0.150 1.050 0.270 0.210 0.100 19.800 18.300 0.500 - 9.900 0.500 0 40 20.200 18.500 - 10.100 0.700 5 40 0.0197 0.7795 0.7205 - 0.3898 0.0197 0 0.0020 0.0374 0.0067 0.0039 Typ Min Max 0.0472 0.0059 0.0413 0.0106 0.0083 0.0039 0.7953 0.7283 - 0.3976 0.0276 5
Symbol Typ A A1 A2 B C CP D D1 e E L N Min
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Part numbering
M27C4002
6
Part numbering
Table 17.
Example: Device Type M27 Supply Voltage C = 5V Device Function 4002 = 4 Mbit (256Kb x16) Speed -45 = 45 ns (1) -60 (1) = 60 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns -20 = 200 ns VCC Tolerance blank = 10% X = 5% Package F = FDIP40W B = PDIP40 C = PLCC44 N = TSOP40: 10 x 20 mm Temperature Range 1 = 0 to 70 C 6 = -40 to 85 C Options TR = Tape & Reel Packing
1. High Speed, see Section 4: DC and AC parameters for further information.
Ordering Information Scheme
M27C4002 -80 X C1 TR
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
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M27C4002
Revision history
7
Revision history
Table 18.
Date September 1998 25-Sep-2000 30-Aug-2001
Document revision history
Revision 1 2 3 First Issue AN620 Reference removed 70ns speed class added Datasheet converted to new corporate template. Packages are ECOPACK(R) compliant. JLCCC32W package removed. PLCC44 outline and mechanical data. TSOP40 10x20mm mechanical data updated. Additional Burn-in options removed from Table 17: Ordering Information Scheme. Changes
06-Apr-2006
4
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M27C4002
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